제이에스알티

제이에스알티 로고

제이에스알티
  • 신뢰성교육
  • 전기·전자제품의 원인불명고장
  • 신뢰성교육

    홈페이지를 방문해주셔서 감사합니다.

    전자기기의 원인불명고장 메커니즘

    전자기기의 원인불명고장 메커니즘 (NFF, TNI, CND, NTF, RTOK)

    NFF (No-fault-found) 의 현상

    NFF 의 정의

    NFF 의 종류

    TNI (trouble-not-identified), CND (can-not duplicate), NTF (no-trouble found), RTOK (retest OK)

    Intermittent Failures

    The impact of intermittents

    NFF test sensitivities

    C&E diagram (fishbone diagram)for NFF conditions in electronic products

    Characteristics of Intermittent Failures

    NFF 발생이 증가하는 원인

    An approach to assess NFF

    People category
    Machine category
    Method category
    Intermittent failure category
    ▷ PCB, Components, Connects, Interconnects
    ▷ C&E diagram (Ishikawa diagram) of intermittent failures in electronic assemblies

    NFF 고장 메커니즘

    Printed circuit board category

    ECM (electrochemical migration)
    CFF (conductive filament formation) or CAF (conductive anodic filament)
    Via cracking due to environmental stress or manufacturing method
    PCB warpage due to CTE mismatch : open trace
    Black pad phenomena (ENIG pad finish)
    Kirkendall voiding (ENIG pad finish)

    Connector category

    Galvanic corrosion : Bond pad corrosion, battery spring contact, etc.
    Fretting corrosion phenomena

    Component – PCB interconnects category

    Intermittent failure due to improper Micro-via plating in PCB
    Intermittent failure due to open trace in PCB
    Inner layer separations or inclusions
    Separation or inclusions between plating layers
    Solder joint cracks due to thermal cycling or vibration environmental loading conditions
    Stress relaxation due to CTE mismatch
    High homologous temperature of solder alloys

    Component category : IC level or Package level

    Intermittent failures due to creep corrosion
    Intermittent failures due to tin whiskers
    Wire bond lifts
    ▷ Delamination
    ▷ Popcorning
    ▷ IMC growth
    ▷ Fatigue
    Single event upset (SEU)
    ▷ Soft error
    COMS의 Latch-up
    MOSFET의 Snapback breakdown
    ESD (electrostatic discharge)
    HCI (hot carrier injection)
    반도체 package의 응력에 의한 leak 불량

    Component category : Passive components

    Relay on/off 반복동작시 접촉저항 변화에 의한 오동작
    Switch 의 접촉저항 변화에 의한 오동작
    Switch 의 bounce 및 chattering 에 의한 신호 출력 불량에 의한 오동작
    Ceramic capacitor 의 압전효과에 의한 오동작
    MLCC crack에 의한 intermittent failure