제이에스알티
신뢰성교육
홈페이지를 방문해주셔서 감사합니다.
전자기기의 원인불명고장 메커니즘
전자기기의 원인불명고장 메커니즘 (NFF, TNI, CND, NTF, RTOK)
NFF (No-fault-found) 의 현상
NFF 의 정의
NFF 의 종류
- TNI (trouble-not-identified), CND (can-not duplicate), NTF (no-trouble found), RTOK (retest OK)
Intermittent Failures
The impact of intermittents
NFF test sensitivities
C&E diagram (fishbone diagram)for NFF conditions in electronic products
Characteristics of Intermittent Failures
NFF 발생이 증가하는 원인
An approach to assess NFF
- People category
- Machine category
- Method category
- Intermittent failure category
▷ PCB, Components, Connects, Interconnects
▷ C&E diagram (Ishikawa diagram) of intermittent failures in electronic assemblies
NFF 고장 메커니즘
Printed circuit board category
- ECM (electrochemical migration)
- CFF (conductive filament formation) or CAF (conductive anodic filament)
- Via cracking due to environmental stress or manufacturing method
- PCB warpage due to CTE mismatch : open trace
- Black pad phenomena (ENIG pad finish)
- Kirkendall voiding (ENIG pad finish)
Connector category
- Galvanic corrosion : Bond pad corrosion, battery spring contact, etc.
- Fretting corrosion phenomena
Component – PCB interconnects category
- Intermittent failure due to improper Micro-via plating in PCB
- Intermittent failure due to open trace in PCB
- Inner layer separations or inclusions
- Separation or inclusions between plating layers
- Solder joint cracks due to thermal cycling or vibration environmental loading conditions
- Stress relaxation due to CTE mismatch
- High homologous temperature of solder alloys
Component category : IC level or Package level
- Intermittent failures due to creep corrosion
- Intermittent failures due to tin whiskers
- Wire bond lifts
▷ Delamination
▷ Popcorning
▷ IMC growth
▷ Fatigue
- Single event upset (SEU)
▷ Soft error
- COMS의 Latch-up
- MOSFET의 Snapback breakdown
- ESD (electrostatic discharge)
- HCI (hot carrier injection)
- 반도체 package의 응력에 의한 leak 불량
Component category : Passive components
- Relay on/off 반복동작시 접촉저항 변화에 의한 오동작
- Switch 의 접촉저항 변화에 의한 오동작
- Switch 의 bounce 및 chattering 에 의한 신호 출력 불량에 의한 오동작
- Ceramic capacitor 의 압전효과에 의한 오동작
- MLCC crack에 의한 intermittent failure